E2TAC utilizes resources available at the College of Nanoscale Science and Engineering at the University at Albany-SUNY towards energy and environmental technologies.  CNSE is located at the Albany NanoTech Complex, the most advanced research complex of its kind at any university in the world. The complex houses the only pilot prototyping facilities in the academic world for the two standard sizes in thin film process technology, the 200-millimeter (or 8-inch) wafer, and the 300-millimeter (or 12-inch) wafer.
Comprehensive research and process tools and instruments are in place to study nano/micro systems, nanoelectronics, nanophotonics, nanotechnology applications in the energy and power arenas and general nanoscale science and technology.

Major 200mm Wafer Processing Capabilities

Most of the tools listed below can also be used to process 150mm, 100mm, and 75mm wafers.

Lithography and Patterning Tools

• 1 EV Group aligner with front to backside capability
• 1 EV Group wafer bonder
• 1 Photoresist track process center

Thin Film Deposition and Growth Tools

• 10 Specialized 200mm wafer CVD systems
• 5 Commercial stand-alone 200mm wafer CVD tools
• 2 Specialized 200mm wafer CVD system equipped with real-time, in-situ, mass spectral and infrared diagnostics capabilities
• 2 Electrolytic plating systems
• 1 LAM quad 480 CVD cluster tool
• 1 Quester TEOS dielectric deposition tool
• 1 CVC connexion PVD cluster tool
• 1 TEL 4 chamber CVD cluster tool
• 1 Modified novellus MB2 PVD/CVD cluster tool
• 1 TEL 4 chamber PVD cluster tool
• 1 Tube furnace for poly-Si growth
• 1 Tube furnace for silicon di-Oxide growth
• 1 Tube furnace for silicon nitride growth
• 1 RTP furnace
• 1 E-beam evaporation system
• 1 3 MeV tandem accelerator
• 1 Varian 400 keV ion implanter
• 1 Danfisyk 150 keV ion implanter

Etch and Planarization Tools

• 1 Plasma-therm versalok 200mm wafer 2 chamber ICP etch tool
• 1 LAM Dry Etch Work Station
• 4 Wet benches for wet etch and wafer cleaning
• 1 O2-plasma strip system
• 1 AMAT metal etch system
• 2 Strasbaugh dual platten CMP tools

Compound Semiconductor Processing Capabilities

• 1 Two-chamber Applied EPI Mod GEN II molecular beam epitaxy (MBE) system
• 2 Emcore MOCVD systems for GaN growth
• Integrated ultra high vacuum molecular beam epitaxy (Veeco Gen II) and low temperature scanning tunneling microscopy facility for compound semiconductor surface studies and spintronics research

Analytical and Characterization Facilities
Metrology Capabilities

• JEOL 2010F Transmission Electron Microscope (TEM) with EELS
  Typical applications: Carbon nanotubes, quantum well structures, liners, gate oxides
• JEOL 200 CX Transmission Electron Microscope (TEM)
  Typical applications: Characterization of gate oxides, devices, quantum structures
• LEO 1550 Scanning Electron Microscope with a ThermoNoran Voyager Energy Dispersive X-ray Detector and a MaxRAY WDS system
  Typical applications: Device structures, polymers, organic materials
• Hitachi S-4000 Scanning Electron Microscope (SEM) with Energy Dispersive X-ray Detector
  Typical applications: Imaging of small structures, cross sectioned devices, chemical analyses
• LEO 1540 dual beam FIB/SEM with a Princeton Gamma Tech Energy Dispersive X-ray Detector and an HKL Electron Backscatter Diffraction system (EBSD)
  Typical applications: Chip cross-sectioning, photonic devices
• JEOL 8600 WDS Microprobe with 4 crystal detectors
  Typical applications: Chemical analysis of features and films, imaging of sub-micron features
• FEI Focused Ion Beam System (FIB)
  Typical applications: TEM sample preparation
• Thermo VG Scientific Theta Probe X-ray Photoelectron Spectroscopy (XPS)
  Typical applications: Ultra thin films, small area characterization
• Perkin-Elmer PHI 660 Auger Electron Spectroscopy
  Typical applications: Surface chemistry, sputter depth profiling
• Bruker D8 ADVANCE X-ray Diffractometer
  Typical applications: Structure and composition of thin films on 300 mm wafers
• AMAT G2 SEMvision FIB-SEM
  Typical applications: Structure, composition and defect analysis on 200 and 300 mm wafers
• 2 Perkin-Elmer PHI 600 Auger Electron Spectroscopy
  Typical applications: Surface chemistry, sputter depth profiling
• Perkin-Elmer PHI 6300 Quadrupole Dynamic Secondary Ion Mass Spectrometer (SIMS)
  Typical applications: Dopant profiling, trace impurity measurement
• Scintag X-ray Diffractometer (XRD)
  Typical applications: Structure and composition of thin films and powders
• SOPRA Spectroscopic Ellipsometer
  Typical applications: Film thickness; material optical constants
• Digital Instruments Nanoscope III Scanning Probe Microscope (SPM)
  Typical applications: Surface roughness, dimensional analyses
• Digital Imaging Atomic Force Microscope (AFM)
  Typical applications: Surface roughness, etc.
• JEOL 4200 Atomic Force Microscope (AFM)
  Typical applications: Surface roughness, dimensional analysis
• Linear Accelerator
  http://alpha.acclab.albany.edu
  Typical applications: Composition, implantation
• Nicolet Magna 75011 FTIR infrared spectroscopy
  Typical applications: Investigation of thin film bonding configuration

Sample Preparation

• Anatech Hummer 10.2 sputter coating
• Deton Vacuum, Desk II sputter coating
• Fischione model 1020 plasma cleaner
• Gatan ion mill

Sample Measurement

• High Current 4 Probe I-V Testing
• Tektronix 371A curve tracer
• Close Cycle Cryogenic Refrigerator
• Thermal Cycling Refrigerator
• Solar Simulator